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Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
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The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
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Beneficials for Polyimide Flex PCB Boards
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PCB Surface Finish Comparison
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PCB Assembly Blog
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About PCB Assembly
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Why some components need be baked before reflow soldering
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FPC Research Blog
Preparation of FPC based on ultrasonic spraying method_4_Experimental Results
Preparation of FPC based on ultrasonic spraying method_3_Experimental Procedure
Preparation of FPC based on ultrasonic spraying method_2_Experimental Platform and Principle
Preparation of FPC based on ultrasonic spraying method_1_abstract
Research on Layout Design Method of Ultra-thin FPC_4_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_3_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_2_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_1_introduction
Research progress on polyimide FPC_2_the field of FPC
Research progress on polyimide FPC_1_Introduction
Analysis of Vibration Characteristics of FPCBs _4_Summary
Analysis of Vibration Characteristics of FPCBs _3_Finite Element Analysis
Analysis of Vibration Characteristics of FPCBs _2_Theory of Vibration Analysis
Analysis of Vibration Characteristics of FPCBs Under Random Vibration_1_Introduction
Design Methods for FPCBs_5_Practical Application
Design Methods for FPCBs_4_Electrical Circuit Design and Examples
Design Methods for FPCBs_3_Structure Design Method and Examples
Design Methods for FPCBs_2_Component Selection Methodology and Examples.
Research on Design Methods for FPCBs
Application of MPW technique for FPCBs _4_Summary
Application of MPW technique for FPCBs_3_Experimental results
Application of MPW technique for FPCBs_2_Experimental setup
Application of MPW technique for FPCBs_1_Principle of MPW
Application of FPCB in PC motherboards_4_ Results and discussion
Application of FPCB in PC motherboards_3_ Numerical analysis
Application of FPCB in PC_2_ Experimentation
Application of FPCB in PC motherboards
A Bus Planning Algorithm for FPC Design _4_Experimental result
A Bus Planning Algorithm for FPC Design _3_Proposed Algorithm
A Bus Planning Algorithm for FPC Design _2_Preliminaries
A Bus Planning Algorithm for FPC Design _1_Introduction

Application of magnetic pulse welding technique

 

 

for FPCBs lap joints_4_ Experimental Summary 

 

 

 

5.  Summary and conclusions

 

in this work, MPW process was investigated for FPCB lap-joint application in two cases: (1) with Al driver; (2) without Al driver and the main results are summarized a follows:

 

. FPCB sheet can be successfully welded in both cases and the opti- mum bank energy for reliable bonding was about 1.0–1.1 kJ.

 

. The welded area in FPCB lap-joint has concentrated into two lines with 0.6 mm wideness along of middle part of coil.

 

. The welded zone has a good joint quality without any damage or heat affect in polyimide substrates of FPCB.

 

. The deformation of lap-joint is also small for welded samples using Al driver sheet.

 

. The maximum tensile shearing was obtained around 110–140 N for successful welded samples for both cases and it was nearly same as tensile shearing strength of copper layer of FPCB sheet

 

. The gap distance between FPCB sheets before welding has very important effect on welding quality and its optimum was 0.4 mm.

 

. The optical microscope and SIM images of the welded area also show that transition layer was formed without any significant heat-affected  zone  (HAZ).  But  the  wavy  transition  layer  was formed only for samples which were made by using Al driver sheet and this wavy structure was not clear for lap-joint samples without using Al driver sheet.

 

. Application of MPW process without using driver sheet may be restricted to a particular type ofFPCB sheet because ofmany lim- itations for adjusting eddy current, magnetic pressure and skin depth in very thin copper layer ofFPCB sheet. It can be conclude this case is more applicable for FPCB sheets with thicker copper layer.

 

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